Structural ceramics mainly refers to a large class of new ceramic materials that exert their mechanical, thermal and chemical properties. They can be used in many demanding working environments, and thus become the key to the realization of many emerging science and technology. Space technology field In the field of space technology, the manufacture of spacecraft requires structural materials and protective materials that can withstand high temperature and temperature changes, high strength, light weight and long life. In this respect, structural ceramics have an absolute advantage. From the first spacecraft, the use of high temperature and low temperature insulation tiles, carbon-quartz composite ablation materials have been successfully applied to launch and recycle artificial earth satellites. The development of future space technology will be more dependent on the application of new structural materials, in which structural ceramics, especially ceramic-based composites and carbon/carbon composites, are far superior to other materials. The application of high technology is the magic weapon for the victory of modern warfare. In the development of the military industry, high-performance structural ceramics play an important role. For example, advanced subsonic aircraft, its success depends on the application of structural ceramics and fiber-reinforced ceramic matrix composites with high toughness and high reliability. Optical communication industry The optical communication industry is one of the fastest growing high-tech industries in the world, with an output value of more than $3 billion worldwide. The reason for its rapid development is mainly due to the study of the mechanism of fiber loss and the use of fiber joint structural materials. We have successfully developed fiber optic connectors and bushings using zirconia toughened ceramic materials, which have excellent performance and meet the development needs of China's optical communication industry. With the high density and high power of semiconductor devices, the development of integrated circuit manufacturing urgently needs to develop a new type of substrate material with good insulation and fast heat conduction. The high thermal conductivity aluminum nitride and silicon carbide substrate materials that were introduced in the mid-to-late 1980s are gradually replacing the traditional alumina substrates. In this field, the thermal conductivity of high thermal conductivity aluminum nitride ceramics successfully developed by me has reached 228 W/m. ×K, performance is at the forefront of domestic and foreign. Aluminum nitride-glass composite material has become a research hotspot in the field of contemporary electronic packaging materials. Its thermal conductivity is 5-10 times that of alumina-glass, sintering temperature is less than 1000 °C, and it can be used with wiring materials such as silver and copper. Co-firing to produce a multilayer wiring board with good thermal and electrical properties. The aluminum nitride-glass composite material I developed has a thermal conductivity of 10.8 W/m×K, which is in the leading position in the world. It satisfies the requirements of miniaturization and intensification of large-scale integrated circuits. Thermometer,Temperature Gauge,Temperature Sensor,Temperature Indicator Jiangsu Pinpai Technology Co., Ltd. , https://www.jspingpa.com